GalaxyCore Inc, (“GalaxyCore”, “We” or “our”), largest and most advanced CMOS image sensor IC fabless company in China, today announced it successfully developed Through-Silicon-Illumination (“TSI”) technology for image sensor manufacturing on 12-inch wafer based on 90nm (“nanometer”) logic process in Taiwan Semiconductor Manufacturing Company Limited (“TSMC”), and will commence volume production shortly.
GalaxyCore owns wide scope of proprietary intellectual property of TSI technology, including analog design, pixel layout, and pixel-related process technology. This leading-edge technology applies to manufacturing of image sensors with pixel size of 1.75um to 1.1um, and will further extend to 0.9um pixel size node. GalaxyCore expects to launch 5-Megapixel, 8-Megapixel and 13-Megapixel image sensor products utilizing this technology in 2014 and 2015.
Our TSI technology has the following features,
“We are very excited about the timely success in TSI technology development and its outstanding performance revealed so far,” said GalaxyCore CEO Zhao Lixin, “I would like to thank TSI R&D team in GalaxyCore for their excellent job and thank TSMC for their great supports. We will promptly launch 5-Megapixel, 8-Megapixel and 13-Megapixel image sensors utilizing this TSI technology with 1.1 – 1.4um pixel size in the next a few months. We dedicate to offer high performance and cost efficient world-class image sensors products for the fast-growing market of mobile devices such as smartphones and tablets.”
About GalaxyCore Inc.
Founded in 2003, GalaxyCore Inc. becomes a leading China-based fabless image sensor company targeting the global mobile device and consumer electronics market. It designs, develops and markets high-quality and cost-efficient CMOS image sensor devices and LCD driver chips. Headquartered in Shanghai, GalaxyCore established offices in Beijing, Shenzhen and Taiwan, set up research and development center in the United States, and logistics center in Hong Kong.